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 Composite Transistors
XN0B301 (XN1B301)
Silicon PNP epitaxial planer transistor (Tr1) Silicon NPN epitaxial planer transistor (Tr2)
For general amplification
2.90+0.20 -0.05 1.90.1 (0.95) (0.95) 3 4 5
Unit: mm
0.16+0.10 -0.06
1.50+0.25 -0.05
2.8+0.2 -0.3
s Features
q q
10
1.1+0.2 -0.1
(0.65)
Two elements incorporated into one package. (Tr1 emitter is connected to Tr2 base.) Reduction of the mounting area and assembly cost by one half.
2 0.30+0.10 -0.05
1
s Basic Part Number of Element
q
s Absolute Maximum Ratings
Parameter Collector to base voltage Collector to emitter voltage Tr1 Emitter to base voltage Collector current Peak collector current Collector to base voltage Collector to emitter voltage Tr2 Emitter to base voltage Collector current Peak collector current Total power dissipation Overall Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP VCBO VCEO VEBO IC ICP PT Tj Tstg
(Ta=25C)
Ratings -60 -50 -7 -100 -200 60 50 7 100 200 300 150 -55 to +150 Unit V V V mA mA V V V mA mA mW C C
1 : Collector (Tr1) 2 : Collector (Tr2) 3 : Emitter (Tr2)
4 : Base (Tr2) Emitter (Tr1) 5 : Base (Tr1) EIAJ : SC-74A Mini5-G1 Package
Marking Symbol: 4Q Internal Connection
5 4 3 2 Tr1 1
Tr2
Note) The Part number in the Parenthesis shows conventional part number.
0 to 0.1
2SB709A (2SB0709A) +2SD601A (2SD0601A)
1.1+0.3 -0.1
0.40.2
5
1
Composite Transistors
XN0B301
(Ta=25C)
Symbol VCBO VCEO VEBO ICBO ICEO hFE VCE(sat) fT Cob Conditions IC = -10A, IE = 0 IC = -2mA, IB = 0 IE = -10A, IC = 0 VCB = -20V, IE = 0 VCE = -10V, IB = 0 VCE = -10V, IC = -2mA IC = -100mA, IB = -10mA VCB = -10V, IE = 1mA, f = 200MHz VCB = -10V, IE = 0, f = 1MHz 160 - 0.3 80 2.7 min -60 -50 -7 - 0.1 -100 460 - 0.5 V MHz pF typ max Unit V V V A A
s Electrical Characteristics
q
Tr1
Parameter
Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector cutoff current Forward current transfer ratio Collector to emitter saturation voltage Transition frequency Collector output capacitance
q
Tr2
Parameter Symbol VCBO VCEO VEBO ICBO ICEO hFE VCE(sat) fT Cob Conditions IC = 10A, IE = 0 IC = 2mA, IB = 0 IE = 10A, IC = 0 VCB = 20V, IE = 0 VCE = 10V, IB = 0 VCE = 10V, IC = 2mA IC = 100mA, IB = 10mA VCB = 10V, IE = -2mA, f = 200MHz VCB = 10V, IE = 0, f = 1MHz 160 0.1 150 3.5 min 60 50 7 0.1 100 460 0.3 V MHz pF typ max Unit V V V A A
Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector cutoff current Forward current transfer ratio Collector to emitter saturation voltage Transition frequency Collector output capacitance
2
Composite Transistors
Common characteristics chart PT -- Ta
500
XN0B301
Total power dissipation PT (mW)
400
300
200
100
0 0 40 80 120 160
Ambient temperature Ta (C)
Characteristics charts of Tr1 IC -- VCE
-60 Ta=25C -50 IB= -300A -50 -60 VCE=-5V Ta=25C
IC -- I B
-400 -350
IB -- VBE
VCE=-5V Ta=25C
Collector current IC (mA)
Collector current IC (mA)
-250A -40 -200A -30
-40
Base current IB (A)
-300 -250 -200 -150 -100 -50
-150A
-30
-20
-100A
-20
-10
-50A
-10
0 0 -2 -4 -6 -8 -10 -12 -14 -16 -18
0 0 -100 -200 -300 -400
0 0 -0.4 -0.8 -1.2 -1.6
Collector to emitter voltage VCE (V)
Base current IB (A)
Base to emitter voltage VBE (V)
IC -- VBE
-240 -10
VCE(sat) -- IC
Collector to emitter saturation voltage VCE(sat) (V)
VCE= - 5V IC/IB=10
hFE -- IC
600 VCE= -10V
-200
25C Ta=75C -25C
-3 -1 -0.3 -25C -0.1 -0.03 -0.01 Ta=75C 25C
Forward current transfer ratio hFE
500
Collector current IC (mA)
-160
400 Ta=75C 300 25C -25C 200
-120
-80
-40
100
-0.003 -0.001 -1
0 0 -0.4 -0.8 -1.2 -1.6 -2.0
-3
-10
-30
-100 -300 -1000
0 -1
-3
-10
-30
-100 -300 -1000
Base to emitter voltage VBE (V)
Collector current IC (mA)
Collector current IC (mA)
3
Composite Transistors
fT -- IE
160 8
XN0B301
Cob -- VCB
6
f=1MHz IE=0 Ta=25C
NF -- IE
VCB=-5V f=1kHz Rg=2k Ta=25C
Collector output capacitance Cob (pF)
VCB=-10V Ta=25C
Transition frequency fT (MHz)
140 120 100 80 60 40 20 0 0.1
7 6 5 4 3 2 1 0 -1
5
Noise figure NF (dB)
4
3
2
1
0.3
1
3
10
30
100
-2 -3 -5
-10
-20 -30 -50
-100
0 0.01 0.03
0.1
0.3
1
3
10
Emitter current IE (mA)
Collector to base voltage VCB (V)
Emitter current IE (mA)
NF -- IE
20 18 16 VCB=-5V Rg=50k Ta=25C
300 200
h Parameter -- IE
300 200
hfe 100
h Parameter -- VCE
IE=2mA f=270Hz Ta=25C
hfe 100
Noise figure NF (dB)
14 12 10 8 6 4 2 0 0.1 1kHz 10kHz
5 3 2 1 0.1 hre 0.2 0.3 0.5 (x10-4) 1 2 VCE=-5V f=270Hz Ta=25C 3 5 10 hie (k)
Parameter h
f=100Hz
30 20 10
hoe (S)
Parameter h
50
50 30 20 hoe (S) 10 5 3 2 1 0.1 hre (x10-4) hie (k)
0.2 0.3 0.5
1
2
3
5
10
0.2 0.3 0.5
1
2
3
5
10
Emitter current IE (mA)
Emitter current IE (mA)
Collector to emitter voltage VCE (V)
Characteristics charts of Tr2 IC -- VCE
60 Ta=25C IB=160A 50 1000 1200 VCE=10V Ta=25C
IB -- VBE
240
IC -- VBE
VCE=10V 200
Collector current IC (mA)
Base current IB (A)
140A 40 120A 100A 30 80A 20 60A 40A 10 20A 0 0 2 4 6 8 10
Collector current IC (mA)
800
160
600
120 Ta=75C 80
25C
-25C
400
200
40
0 0 0.2 0.4 0.6 0.8 1.0
0 0 0.4 0.8 1.2 1.6 2.0
Collector to emitter voltage VCE (V)
Base to emitter voltage VBE (V)
Base to emitter voltage VBE (V)
4
Composite Transistors
IC -- IB
240
100
XN0B301
VCE(sat) -- IC
Collector to emitter saturation voltage VCE(sat) (V)
IC/IB=10
hFE -- IC
600 VCE=10V
200
30 10 3 1 0.3 25C 0.1 0.03 0.01 0.1 Ta=75C -25C
Forward current transfer ratio hFE
VCE=10V Ta=25C
500
Collector current IC (mA)
160
400
Ta=75C 25C
120
300
-25C
80
200
40
100
0 0 200 400 600 800 1000
0.3
1
3
10
30
100
0 0.1
0.3
1
3
10
30
100
Base current IB (A)
Collector current IC (mA)
Collector current IC (mA)
fT -- IE
300 VCB=10V Ta=25C 240
NV -- IC
VCE=10V GV=80dB 200 Function=FLAT Ta=25C 160
Transition frequency fT (MHz)
180
Noise voltage NV (mV)
240
120
Rg=100k
120
80
22k 4.7k
60
40
0 -0.1 -0.3
-1
-3
-10
-30
-100
0 10
20 30 50
100
200 300 500 1000
Emitter current IE (mA)
Collector current IC (A)
5
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR


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